As the number of applications for MicroGroove Technology continues to grow, so too does the need for research to guide engineers in the design of industry-first products.
The latest in heat pump design was presented at the 11th International Energy Agency Heat Pump Conference (IEA HPC) in Montreal, Canada, this month.
The technical paper entitled “Experimental investigation and structure optimisation of distributors used in heat pump air conditioner with microgroove tubes” was presented by Professor Guoliang Ding, from the Institute of Refrigeration and Cryogenics at Shanghai Jiao Tong University.
Coauthors of the paper include several members of the technical staff at International Copper Association (ICA) in China.
The paper described how to optimise coil design to allow for additional branch circuits in the design of heat pumps with smaller diameter copper tubes.
MicroGroove Technology was also on display in the exhibitor space and an informative new brochure titled “MicroGroove Technology for Heat Pumps: Questions and Answers” was also distributed at the conference.
ICA MicroGroove team leader, Nigel Cotton, said heat pump technology has taken great strides forward both in terms of technology development and market acceptance.
He said the efficiency of heat pumps compared to other approaches to heating has earned the technology a place in the minds of policymakers intent on reducing carbon dioxide emissions by increasing the energy efficiency of systems for air conditioning, refrigeration and heating.
“The same advantages that apply to air conditioners and refrigeration equipment also apply to the evaporator and condenser coils used in residential heat pumps,” Cotton said.
“That includes hot water heat pumps as well as heat pumps that are used to heat indoor spaces.”
For more information about the use of MicroGroove in heat pump designs, visit www.microgroove.net/heat-pumps.
For information about the ICA, visit www.copperinfo.com